Cochle teamed up with NXP to launch a new generation of implantable hearing aids

NXP Semiconductors and Cochlear, the world's leading provider of implantable hearing aids, today announced the signing of a partnership between Cochlear's next-generation implantable hearing aid chip design and production protocol.

The agreement includes the definition, development and supply of ultra-low power speech processors and wireless communication ICs for Cochlear's next generation hearing aid products.

Jan Janssen, senior vice president of design and development at Cochlear, said, "In recent years, NXP's cooperation with the Cochlear team has been very successful. The two sides complement each other and complement each other. This has become our leading implantable hearing aid product. The key is that this newly signed agreement will further extend our partnership to R&D and production in the field of wireless communication technology as an important part of our future technology development."

NXP's Chief Technology Officer Rene Penning de Vries said, "We are very proud of NXP's ultra-low-power magnetic induction wireless technology and CoolFluxTM DSP technology for the industry-leading Cochlear implantable hearing aid solutions. The long-term partnership of Lear once again demonstrates NXP's development strategy of striving for market leadership in high-performance mixed-signal applications. It also demonstrates NXP's determination and actions to enter the medical field, where we will mainly target wireless (planting) Into the emerging applications of sensors, medical human area networks and personal care instruments."

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